Rogers RO4730G3 2-Layer 20mil ENEPIG PCB for Base Station Antennas
1.Introduction to Core Technologies
Rogers RO4730G3 is hydrocarbon / ceramic / woven glass UL 94 V-0 antenna grade laminates that are a reliable, low-cost alternative to conventional PTFE-based laminates. The resin systems of RO4730G3 dielectric materials provide the necessary properties for ideal antenna performance. RO4730G3 antenna grade laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing. These materials do not require the special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. RO4730G3 laminates are an affordable alternative to conventional PTFE-based antenna materials, allowing for designers to optimize cost and performance.
2.Key Performance Characteristics:
Dk of 3.0 ±0.05 at 10GHz
Dissipation factor of 0.0028 at 10GHz
Thermal coefficient of Dk of 34 ppm/°C
Coefficient of thermal expansion matched to copper
Tg >280°C
Decomposition Temperature (Td) of 411°C TGA
Coefficient of Thermal Expansion - x y z : 15.9 ppm/°C, 14.4 ppm/°C, 35.2 ppm/°C
Thermal Conductivity of 0.45W/mk
3.Benefits
Low Loss & High Signal Integrity: Low loss dielectric with low profile foil delivers reduced PIM and low insertion loss for superior RF performance
Lightweight Design: Unique filler/closed microspheres technology makes material 30% lighter than PTFE/Glass without compromising performance
Excellent Thermal Reliability: Low Z-axis CTE <30ppm/°C and high Tg >280°C ensure reliable performance across temperature extremes
Consistent Electrical Performance: Low TCDk <40 ppm/°C maintains stable circuit characteristics over varying conditions
Manufacturing Efficiency: Specially formulated thermoset resin system enables ease of fabrication and reliable PTH process capability
Design Flexibility: Compatible with automated assembly and supports various antenna design configurations
Environmental Compliance: Lead-free process compatible and RoHS compliant for sustainable manufacturing
4.PCB Details
| Parameter | Specification |
|---|---|
| Base Material | RO4730G3 |
| Manufacturer | Rogers Corporation |
| Layer Count | 2 layers |
| Board Dimensions | 85.6mm × 103mm = 1PCS, ±0.15mm |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | No |
| Finished Board Thickness | 0.6mm |
| Finished Cu Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | ENEPIG |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Blue |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper Layer 1 - 35 μm
Rogers RO4730G3 Core - 0.508 mm (20mil)
Copper Layer 2 - 35 μm
6.PCB Statistics
Components: 32
Total Pads: 42
Thru Hole Pads: 26
Top SMT Pads: 16
Bottom SMT Pads: 0
Vias: 14
Nets: 2
7.Typical Applications
Cellular Base Station Antennas
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
